Semiconductor package structure and method for fabricating the same

A method for fabricating a semiconductor package structure, comprising the steps of:

• providing a carrier having at least one cavity on a surface thereof;
• mounting at least one semiconductor chip in the cavity of the carrier, the semiconductor chip having a plurality of electrode pads;
• applying a dielectric layer on the carrier and the semiconductor chip, and filling the material of the dielectric layer into the gap between the cavity of the carrier and the semiconductor chip;
• forming a plurality of vias in the dielectric layer;
• forming a circuit layer and a plurality of conductive structures on a surface of the dielectric layer and in the vias, wherein the circuit layer and the conductive structures are electrically connected to the electrode pads of the semiconductor chip;
• providing a conductive adhesive layer having a plurality of conductive adhesive posts, and mounting the conductive adhesive layer on the dielectric layer, wherein the conductive adhesive posts of the conductive adhesive layer are electrically connected to the electrode pads of the semiconductor chip;
• and
• providing a circuit board having a plurality of conductive pads on a surface thereof, and mounting the circuit board on the conductive adhesive layer, such that the conductive pads of the circuit board are electrically connected to the electrode pads of the semiconductor chip by the conductive adhesive posts of the conductive adhesive layer.

A semiconductor package structure, comprising:

• a carrier having at least one cavity on a surface thereof;
• at least one semiconductor chip having a plurality of electrode pads and mounted in the cavity of the carrier;
• a dielectric layer applied on the carrier and the semiconductor chip, wherein a circuit layer and a plurality of conductive structures are formed on the dielectric layer and are electrically connected to the electrode pads of the semiconductor chip;
• a conductive adhesive layer mounted on the dielectric layer, wherein the conductive adhesive layer is formed with a plurality of conductive adhesive posts therein that are electrically connected to the circuit layer and the conductive structures of the dielectric layer;
• and
• a circuit board having a plurality of conductive pads on a surface thereof and mounted on the conductive adhesive layer, wherein the conductive pads of the circuit board are electrically connected to the circuit layer and the conductive structures of the dielectric layer by the conductive adhesive posts of the conductive adhesive layer and are further electrically connected to the electrode pads of the semiconductor chip.