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US 2006/0125077 A1Published application
Semiconductor device
OwnerSadakazu Akaike, Akinobu Inoue +4inventors
InventorsSadakazu Akaike, Akinobu Inoue, Atsunori Kajiki, Hiroyuki Takatsu, Takashi Tsubota, Norio Yamanishi
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Abstract
A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.
Claims4
A semiconductor device comprising:
- a semiconductor chip;
- a substrate on which the semiconductor chip is mounted;
- a mounting terminal that is arranged on a first side of the substrate;
- and
- a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.
2 more elements
Dependencies are inferred from the claim text.