Circuit boards, electronic devices, and methods of manufacturing thereof
AssigneeSOHKi Co., Ltd.
InventorsMasato Fukagaya, Osamu Koido
Life of this patent
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Abstract
A circuit board 3 includes a ceramic substrate 6 with an internal layer circuit 7 therein. The internal layer circuit 7 is used to electroplate a plurality of component electrodes 8, a plurality of terminal electrodes 9, and a loop electrode 10 that surrounds the component electrodes 8 on surfaces of the substrate 6 by using the internal layer circuit 7. A hole is bored in a periphery of the substrate 6 to sever the internal layer circuit 7 and isolate the component electrodes 8 from the loop electrode 10. Part of the severed internal layer circuit 7 is then used to electroplate a surface of the loop electrode 10 with a brazing material 5 to provide the circuit board 3.
Claims15
A circuit board comprising:
- a substrate that includes an insulating material;
- at least one component electrode and at least one loop electrode that surrounds the component electrode, wherein both of said component electrode and said loop electrode are electroplated on the substrate using the same metallic material;
- and
- a brazing material electroplated on the loop electrode.
A method of manufacturing a circuit board, comprising the steps of:
- providing a substrate which contains an insulating material and includes at least one internal layer circuit;
- simultaneously electroplating at least one component electrode and at least one loop electrode that surrounds the component electrode on the substrate, the component electrode and the loop electrode being electroplated from the same metallic material by using the at least one internal layer circuit;
- severing the at least one internal layer circuit to isolate the component electrode from the loop electrode, and
- electroplating a brazing material on the loop electrode by using part of the severed internal layer circuit.
Dependencies are inferred from the claim text.