Memory module and method of mounting memory device on PCB for memory module

A method of sequentially mounting and connecting memory devices to a PCB having an axis of elongation to form a memory module, the method comprising:

• mounting a first memory device at a left part of the PCB so that a base line along a longitudinal axis of the first memory device lies at an angle of about 0° with respect to the axis of elongation of the PCB;
• mounting a second memory device to the right of the first memory device on the PCB so that a base line along a longitudinal axis of the second memory device lies at an angle of about 45° with respect to the axis of elongation of the PCB;
• mounting one or more third memory devices to the right of the second memory device on the PCB so that a base line along a longitudinal axis of the at least one third memory device lies at an angle of about 90° with respect to the axis of elongation of the PCB;
• mounting a fourth memory device to the right of the third memory device on the PCB so that base line along a longitudinal axis of the fourth memory device lies at an angle of about 135° with respect to the axis of elongation of the PCB;
• and
• mounting a fifth memory device to the right of the fourth memory device on the PCB so that a base line along a longitudinal axis of the fifth memory device lies at an angle of about 180° with respect to the axis of elongation of the PCB.

A method of sequentially mounting and connecting memory devices to a PCB having an axis of elongation to form a memory module, the method comprising:

• mounting a first memory device at a right part of the PCB so that a base line along a longitudinal axis of the first memory device lies at an angle of about 0° with respect to the axis of elongation of the PCB;
• mounting a second memory device to the left of the first memory device on the PCB so that a base line along a longitudinal axis of the second memory device lies at an angle of about 45° with respect to the axis of elongation of the PCB;
• mounting one or more third memory devices to the left of the second memory device on the PCB so that a base line along a longitudinal axis of the at least one third memory device lies at an angle of about 90° with respect to the axis of elongation of the PCB;
• mounting a fourth memory device to the left of the third memory device on the PCB so that base line along a longitudinal axis of the fourth memory device lies at an angle of about 135° with respect to the axis of elongation of the PCB;
• and
• mounting a fifth memory device to the left of the fourth memory device on the PCB so that a base line along a longitudinal axis of the fifth memory device lies at an angle of about 180° with respect to the axis of elongation of the PCB.

A memory module including memory devices that are sequentially connected and mounted on a PCB having an axis of elongation, the module comprising:

• a first memory device mounted at a left part of the PCB so that a base line along a longitudinal axis of the first memory device lies at an angle of about 0° with respect to the axis of elongation of the PCB;
• a second memory device mounted to the right of the first memory device on the PCB so that a base line along a longitudinal axis of the second memory device lies at an angle of about 45° with respect to the axis of elongation of the PCB;
• one or more third memory devices mounted to the right of the second memory device on the PCB so that a base line along a longitudinal axis of the at least one third memory device lies at an angle of about 90° with respect to the axis of elongation of the PCB;
• a fourth memory device mounted to the right of the third memory device on the PCB so that base line along a longitudinal axis of the fourth memory device lies at an angle of about 135° with respect to the axis of elongation of the PCB;
• and
• a fifth memory device mounted to the right of the fourth memory device on the PCB so that a base line along a longitudinal axis of the fifth memory device lies at an angle of about 180° with respect to the axis of elongation of the PCB.

A memory module including memory devices that are sequentially connected and mounted on a PCB having an axis of elongation, the module comprising:

• a first memory device mounted at a right part of the PCB so that a base line along a longitudinal axis of the first memory device lies at an angle of about 0° with respect to the axis of elongation of the PCB;
• a second memory device mounted to the left of the first memory device on the PCB so that a base line along a longitudinal axis of the second memory device lies at an angle of about 45° with respect to the axis of elongation of the PCB;
• one or more third memory devices mounted to the left of the second memory device on the PCB so that a base line along a longitudinal axis of the at least one third memory device lies at an angle of about 90° with respect to the axis of elongation of the PCB;
• a fourth memory device mounted to the left of the third memory device on the PCB so that base line along a longitudinal axis of the fourth memory device lies at an angle of about 135° with respect to the axis of elongation of the PCB;
• and
• a fifth memory device mounted to the left of the fourth memory device on the PCB so that a base line along a longitudinal axis of the fifth memory device lies at an angle of about 180° with respect to the axis of elongation of the PCB.