Integrated circuit with stacked-die configuration utilizing substrate conduction
AssigneeAgere Systems Inc.
InventorThaddeus Gabara
Life of this patent
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Abstract
An integrated circuit comprises a plurality of integrated circuit die arranged in a stack, with a given die other than a top die of the stack carrying current for itself and at least one additional die of the stack via substrate conduction. In one arrangement, each of the die other than a bottom die of the stack carries its power supply current by substrate conduction via a bus or other power supply conductor of an underlying die.
Claims20
An integrated circuit comprising:
- a first integrated circuit die having a first substrate and a first power supply conductor formed over a portion of the first substrate;
- and
- a second integrated circuit die having a second substrate and a second power supply conductor formed over a portion of the second substrate;
- the second integrated circuit die being stacked on and at least partially overlapping the first integrated circuit die;
- the first power supply conductor of the first integrated circuit die being conductively coupled to the second substrate of the second integrated circuit die;
- wherein power supply current associated with the second integrated circuit die is carried via the first power supply conductor of the first integrated circuit die by substrate conduction through the second substrate.
An integrated circuit comprising:
- a plurality of integrated circuit die arranged in a stack;
- wherein each of the die other than a bottom die of the stack carries its power supply current by substrate conduction via a power supply conductor of an underlying die.
An integrated circuit comprising:
- a plurality of integrated circuit die arranged in a stack;
- wherein a given die other than a top die of the stack carries current for itself and at least one additional die via substrate conduction.
A method of providing supply current to a stacked-die integrated circuit, the integrated circuit comprising at least a first integrated circuit die and a second integrated circuit die, the first integrated circuit die having a first substrate and a first power supply conductor formed over a portion of the first substrate, the second integrated circuit die having a second substrate and a second power supply conductor formed over a portion of the second substrate, the second integrated circuit die being stacked on and at least partially overlapping the first integrated circuit die, the method comprising the steps of:
- conductively coupling the first power supply conductor of the first integrated circuit die to the second substrate of the second integrated circuit die;
- and
- carrying power supply current associated with the second integrated circuit die via the first power supply conductor of the first integrated circuit die by substrate conduction through the second substrate.
An integrated circuit comprising:
- a first integrated circuit die having a first substrate and a first power supply conductor formed over a portion of the first substrate;
- and
- a second integrated circuit die having a second substrate and a second power supply conductor formed over a portion of the second substrate;
- the second integrated circuit die being stacked on and at least partially overlapping the first integrated circuit die;
- wherein power supply current for the second integrated circuit die is carried via the first power supply conductor of the first integrated circuit die by substrate conduction through the first and second substrates.
Dependencies are inferred from the claim text.