Multi-part lead frame with dissimilar materials
OwnerS. Hinkle, Jerry Brooks +1inventors
InventorsS. Hinkle, Jerry Brooks, David Corisis
Life of this patent
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Abstract
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
Claims20
A multi-part, multi-level lead frame used in conjunction with a semiconductor device assembly, the lead frame comprising:
- an independently formed die paddle used in conjunction with a semiconductor device;
- and
- an independently formed lead frame having portions attached to the independently formed die paddle, the independently formed lead frame including at least two carriers and a plurality of leads, each lead of the plurality of leads having a length terminating adjacent the semiconductor device used in conjunction with the independently formed die paddle, an electrical conductivity of the lead frame being different than an electrical conductivity of the die paddle.
A semiconductor device assembly comprising:
- a semiconductor device including an active surface having at least one bond pad formed thereon;
- a die paddle having the semiconductor device attached thereto, the die paddle substantially formed of a first material, the die paddle formed on a first level;
- a lead frame including at least two carriers and a plurality of leads, each carrier of the at least two carriers having an attachment tab-receiving portion, the lead frame substantially formed of a second material different than the first material of the die paddle, wherein at least one lead of the plurality of leads extends over a semiconductor device attached to the die paddle, does not extend over a semiconductor device attached to the die paddle, overlaps the die paddle, or terminates adjacent the die paddle, the lead frame formed on a second level;
- and
- at least one interconnection between at least one lead of the plurality of leads of the lead frame and the at least one bond pad of the semiconductor device.
In combination, a two part mold for molding a semiconductor device assembly having single piece lead frame therein and a semiconductor device assembly, the combination including:
- a semiconductor device including an active surface having at least one bond pad formed thereon;
- a die paddle having the semiconductor device attached thereto, the die paddle substantially formed of a first material, the die paddle formed on a first level;
- a lead frame including at least two carriers and a plurality of leads, each carrier of the at least two carriers having an attachment tab-receiving portion, the lead frame substantially formed of a second material different than the first material of the die paddle, wherein at least one lead of the plurality of leads extends over a semiconductor device attached to the die paddle, does not extend over a semiconductor device attached to the die paddle, overlaps the die paddle, or terminates adjacent the die paddle, the lead frame formed on a second level;
- and
- at least one interconnection between at least one lead of the plurality of leads of the lead frame and the at least one bond pad of the semiconductor device.
Dependencies are inferred from the claim text.