Semiconductor device and a method of manufacturing the same

A method of manufacturing a semiconductor device comprising the step of:

• (a) providing a lead frame formed with a plurality of patterns including a die pad and a plurality of leads arranged around the die pad;
• (b) mounting a plurality of semiconductor chips over the plurality of die pads respectively;
• (c) electrically connecting the plurality of semiconductor chips and the plurality of leads through a plurality of wires respectively;
• (d) after the step (c), sandwiching the lead frame between an upper molding die and a lower molding die, and injecting resin into a plurality of cavities to form a plurality of resin sealing members, the plurality of cavities being formed between the upper molding die and the lower molding die, and corresponding to the plurality of patterns respectively;
• and
• (e) after the step (d), cutting the lead frame and the plurality of resin sealing members with a dicer to divide the plurality of resin sealing members into individual pieces,
• wherein in the plurality of resin sealing members formed in the step (d), adjacent resin sealing members connect to each other.