Semiconductor chip, and manufacturing method and application of the chip
AssigneeElpida Memory, Inc.
InventorKiyonori Oyu
Life of this patent
Estimating the term…
Abstract
The present invention provides a semiconductor chip that provides a semiconductor device with high reliability and low leak current, and a method of manufacturing such a semiconductor chip, and more specifically, provides a semiconductor chip comprising memory portions and a peripheral circuit portion, where the memory portions and the peripheral circuit portion are formed in a main surface portion of the semiconductor chip, a thickness of the sections of the semiconductor chip passing through the main surface portion in which the memory portions are formed is larger than a thickness of sections of the semiconductor chip passing through the main surface portion in which the peripheral circuit portion is formed, and a method of manufacturing such a semiconductor chip.
Claims10
A semiconductor chip comprising memory portions and a peripheral circuit portion, wherein
- the memory portions and the peripheral circuit portion are formed in a main surface portion of the semiconductor chip,
- a thickness of sections of the semiconductor chip passing through predetermined portions that are part of the main surface portion in which the peripheral circuit portion is formed and that are adjacent to respective memory portions is substantially equal to a thickness of sections of the semiconductor chip passing through the main surface portion in which the memory portions are formed with a normal direction to the surface of the semiconductor chip as a reference, and
- the thickness of the sections of the semiconductor chip passing through the main surface portion in which the memory portions are formed is larger than a thickness of sections of the semiconductor chip passing through the main surface portion in which the peripheral circuit portion is formed except the predetermined portions adjacent to the memory portions with the normal direction as a reference.
Dependencies are inferred from the claim text.