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US 2006/0125037 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeFUJIFILM Corporation
InventorTakeshi Misawa
Life of this patent
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Abstract
The semiconductor device according to this invention is chacterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a light-shading means 104 is arranged in an area corresponding to at least the photoelectric converting portion on the side of the rear surface of the semiconductor substrate.
Claims2
A method for manufacturing a semiconductor device comprising the steps of:
- a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;
- a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate;
- a separating step for separating a bonding structure, obtained by bonding, into semiconductor devices;
- and
- a grinding step for forming a rough surface on the rear surface of the semiconductor substrate to reflect light away from the rear surface.
2 more elements
A method for manufacturing a semiconductor device comprising the steps of:
- a forming step for forming a plurality of semiconductor devices on the front surface of a semiconductor substrate;
- a bonding step for bonding a wiring board on the rear surface of said semiconductor substrate using light-shading adhesive provided between the wiring board and the semiconductor substrate and the light-shading adhesive suppressing light reflected from the rear surface of the semiconductor substrate from reaching the semiconductor device;
- and
- a separating step for separating a bonding structure obtained by bonding, into said semiconductor devices.
1 more element
Dependencies are inferred from the claim text.