Hybrid ALD-CVD of PrxOy/ZrO2 films as gate dielectrics
AssigneeMicron Technology, Inc.
InventorsKie Ahn, Leonard Forbes
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AssigneeMicron Technology, Inc.
InventorsKie Ahn, Leonard Forbes
Estimating the term…
The use of atomic layer deposition (ALD) to form a nanolaminate layered dielectric layer of praseodymium oxide (PrXOY) and zirconium oxide (ZrOZ) and a method of fabricating such a combination gate and dielectric layer produces a reliable structure for use in a variety of electronic devices. The nanolaminate layered dielectric structure is formed by depositing praseodymium by atomic layer deposition onto a substrate surface using precursor chemicals, followed by depositing zirconium onto the substrate using precursor chemicals, and repeating to form the thin laminate structure. A nanolaminate layered dielectric layer of praseodymium oxide and zirconium oxide may be used as the gate insulator of a MOSFET, as a capacitor dielectric in a DRAM, as a tunnel gate insulator in flash memories, or a dielectric in NROM devices, because the high dielectric constant (high-k) of the film provides the functionality of a much thinner silicon dioxide film.
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Dependencies are inferred from the claim text.