High voltage power MOSFET having low on-resistance
AssigneeGeneral Semiconductor, Inc.
InventorRichard Blanchard
Life of this patent
Estimating the term…
Loading patent…
AssigneeGeneral Semiconductor, Inc.
InventorRichard Blanchard
Estimating the term…
A power MOSFET is provided that includes a substrate of a first conductivity type. An epitaxial layer also of the first conductivity type is deposited on the substrate. First and second body regions are located in the epitaxial layer and define a drift region between them. The body regions have a second conductivity type. First and second source regions of the first conductivity type are respectively located in the first and second body regions. A plurality of trenches are located below the body regions in the drift region of the epitaxial layer. The trenches, which extend toward the substrate from the first and second body regions, are filled with a material that includes a dopant of the second conductivity type. The dopant is diffused from the trenches into portions of the epitaxial layer adjacent the trenches.
A power MOSFET, comprising:
The power MOSFET of claim I wherein said dopant is boron.
A power MOSFET, comprising:
Dependencies are inferred from the claim text.