Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same

A mounting substrate for semiconductor light emitting devices comprising:

• a solid metal block including first and second opposing metal faces;
• the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity;
• and
• a cap including a plurality of apertures that extend therethrough, the cap being configured to matingly attach to the solid metal block adjacent the first metal face such that a respective aperture is aligned to a respective cavity.

A semiconductor light emitting device packaging method comprising:

• fabricating a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity;
• forming an insulating layer on the first metal face;
• forming a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities, first conductive traces on the first face and second conductive traces in the plurality of cavities that are configured to connect to a plurality of semiconductor light emitting devices that are mounted in the cavities;
• mounting at least one semiconductor light emitting device in a respective cavity, and electrically connected to the first and second conductive traces;
• and
• matingly attaching to the solid metal block adjacent the first metal face, a cap including a plurality of apertures that extend therethrough, such that a respective aperture is aligned to a respective cavity.

A semiconductor light emitting device package comprising:

• a solid metal block including first and second opposing metal faces, the first metal face including therein a plurality of cavities, a respective one of which is configured to mount at least one semiconductor light emitting device therein and to reflect light that is emitted by the at least one semiconductor light emitting device that is mounted therein away from the respective cavity;
• an insulating layer on the first metal face;
• at least one semiconductor light emitting device in a respective cavity;
• a conductive layer on the insulating layer that is patterned to provide a reflective coating in the plurality of cavities, first conductive traces on the first face and second conductive traces in the plurality of cavities that electrically connect to the at least one semiconductor light emitting device in the respective cavity;
• and
• a cap that is matingly attached to the solid metal block adjacent the first face, the cap including a plurality of apertures that extend therethrough that are affixed such that a respective aperture is aligned to a respective cavity.