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AssigneeInternational Business Machines Corporation
InventorsRobert Groves, Peter Gruber, Kevin Petrarca, Richard Volant, George Walker
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Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention can be applied to form passive elements and interconnects on a conventional semiconductor substrate after the typical BEOL, and prior to packaging. The method may provide better electromigration characteristics, lower resistivity, and higher Q factors for conductive structures. In addition, the method is backwardly compatible and customizable.
A method of forming a conductive structure on a substrate prior to packaging, the method comprising the steps of:
A method of forming a conductive structure on a substrate, the method comprising the steps of:
A ball grid array (BGA) test structure for use on a semiconductor chip, the test structure comprising:
Dependencies are inferred from the claim text.