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OwnerSiegfried Buettner, Roy Knechtelinventors
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The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip (11) and an optical window (10). A hermetic inclusion of at least the optically active of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses (7) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer (1) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing (8) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined.
A process for the production of an optoelectronic component enclosed in plastic and consisting of a semiconductor chip with optically active structures, which may also be present in connection with integrated circuits and an optically transparent window (10) located above it, the optically sensitive part (1) being hermetically sealed against the outer atmosphere by the optical window, which comprises the following production steps:
A process for producing one or several electronic components that are sealed and/or enclosed in plastic from a semiconductor chip (11) with at least one optically active structure (2) and an optically transparent window (10) that is affixed above it by means of a structured connection layer (6) and that hermetically seals the optically active structure (2),
Dependencies are inferred from the claim text.