Method of soldering electronic part and soldering device for soldering the same
AssigneeDenso Corporation
InventorJun Oonishi
Life of this patent
Estimating the term…
Abstract
In a soldering method of soldering a lead of an electronic part to a land of a printed circuit board, a heating ray is applied in a condition that a shielding member is arranged on a surface of the printed circuit board around the land. The shielding member is disposed to prevent at least one of a direct ray and an indirect ray from applying to the printed circuit board around the land. Accordingly, the printed circuit board is prevented from burning around the land.
Claims14
A method of soldering a lead of an electronic part to a land of a printed circuit board, comprising a step of applying a heating ray in a condition that a shielding member, which prevents at least one of a direct ray and an indirect ray from applying to a surface of the printed circuit board around the land, is arranged on the printed circuit board.
A soldering device for soldering a land of an electronic part to a land of a printed circuit board, the soldering device comprising:
- a light emitting member that radiates a heating ray;
- and
- a shielding member that prevents at least one of a direct ray from the light emitting member and an indirect ray from applying to the printed circuit board around the land.
Dependencies are inferred from the claim text.