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US 2006/0124700 A1Published application
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
AssigneeIntel Corporation
InventorsSabina Houle, Ashay Dani
Life of this patent
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Abstract
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
Claims14
A process of forming a heat transfer composite, comprising:
- laminating a solder preform to a matrix to form a heat transfer subsystem;
- and
- bonding the matrix to the solder preform, wherein the matrix is formed by a process selected from:
- co-extruding and singulating a plurality of first heat transfer structures and a second heat transfer structure;
- and
- mixing, casting, curing, and singulating a plurality of first heat transfer structures and a second heat transfer structure.
3 more elements
A method comprising:
- disposing a heat transfer subsystem between a die and a heat spreader;
- and
- bonding the heat transfer subsystem to the die and the heat spreader to form a heat transfer composite from the heat transfer subsystem, wherein the heat transfer composite includes:
- a plurality of first heat transfer structures disposed in a matrix of a second heat transfer structure;
- a solder preform disposed on the matrix;
- and
- a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient.
4 more elements
A computing system comprising:
- a heat spreader;
- a die disposed below the heat spreader;
- a heat transfer composite disposed above and on the die and below and on the heat spreader, wherein the heat transfer composite includes:
- a plurality of first heat transfer structures disposed in a polymer matrix of a second heat transfer structure, wherein the polymer matrix is disposed on the die;
- and
- a solder preform disposed on the polymer matrix, wherein the solder preform is disposed on the heat spreader;
- and
- at least one of an input device and an output device.
5 more elements
Dependencies are inferred from the claim text.