Micro-C-4 semiconductor die and method for depositing connection sites thereon

A system for depositing solder on a plurality of connection sites located on semiconductor dies, said system comprising:

• a movable substrate adapted to move at least one semiconductor die in a first plane;
• a drive including at least one print head, said drive adapted to move said print head in a second plane, said print head including a channel arranged and configured to utilize a gas produced from a metallic compound disposed within said print head to deposit on the semiconductor die a material ejected from a port in the print head and having a diameter of less than about 100 microns;
• and
• a controller for controlling the movements of said drive and said movable substrate.

A print head for ejecting a solder material, comprising:

• a chamber including a metallic compound that generates a gas when heated;
• a reservoir including the solder material;
• a channel in communication with said chamber and said reservoir;
• and
• an ejection port in communication with said channel, wherein a pressure increase due to the generation of the gas in said chamber causes said solder material to be ejected from said ejection port.

A system for depositing solder on a plurality of connection sites located on semiconductor dies, said system comprising:

• a support adapted to move at least one semiconductor die in a first plane;
• a drive including at least one print head, said drive adapted to move said print head in a second plane, said print head including a channel arranged and configured to utilize a gas produced from a metallic compound disposed within said print head to deposit on the semiconductor die a material ejected from a port in the print head and having a diameter of less than about 100 microns;
• and
• a controller for controlling movements of said drive and said support.