US 2006/0124693 A1 · Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device

Abstract

In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles where the polyimide is derived in part from a polysiloxane diamine. These film composites have good mechanical elongation, good dielectric strength, and optionally good adhesivity (i.e. laminatability) (i.e. laminatability) and low modulus, while also possessing good thermal conductivity.

Claims33

Dependent claims

A thermally conductive polyimide film composite comprising:

A. a polyimide component derived from a dianhydride component and a diamine component wherein the diamine is selected from the group consisting of an aromatic diamines, an aliphatic diamines, cycloaliphatic diamines, or combinations thereof;
B. wherein the diamine component is derived in part from a polysiloxane diamine wherein the polysiloxane diamine is present in an amount from 1 to 15 weight-percent of the diamine component;
C. a thermally conductive filler component present in an amount between and including any two of the following numbers 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80 and 85 weight-percent of the film composite;
D. wherein the film composite has a thickness between and including any two of the following numbers 2, 5, 10, 15, 20, 25, 30, 35, 40, 50, 60, 70, 80, 90, 100, 150, 200, 250 and 300 microns.

1 more element

Dependencies are inferred from the claim text.

Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device

Life of this patent

Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device

Life of this patent

Abstract

Claims33