Soldering machine
AssigneeKabushiki Kaisha Toshiba
InventorsRie Aizawa, Hiroyuki Ota, Hiroaki Abe
Life of this patent
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Abstract
A soldering machine includes a solder vessel, an electromagnetic pump, and a nozzle. The solder vessel stores molten solder, and the electromagnetic pump moves the solder by generating electromagnetic force. The electromagnetic pump is submerged below the liquid surface of the solder. The nozzle ejects the solder in the solder vessel onto an object, such as a printed circuit board. Accordingly, the generated heat from the electromagnetic pump is conducted to the solder in the solder vessel, and the solder can be heated to a higher temperature than in the conventional soldering machine.
Claims13
A soldering machine, comprising:
- a solder vessel for containing solder in a molten state,
- an electromagnetic pump mounted at a level to be submerged below the liquid surface of the solder for generating electromagnetic force to move the solder in the solder vessel, and
- a nozzle downstream of the electromagnetic pump that ejects the solder in the solder vessel onto an object to be soldered.
Dependencies are inferred from the claim text.