Method for soldering miniaturised components to a base plate

Method for highly precise, freely positionable fixing of a miniaturized component, in particular comprising a microoptical element, to a predetermined fixing section of a baseplate by means of a solder joint,

• the baseplate having a top and a bottom and the component having a base surface,
• at least the fixing section of the baseplate being coated on the top with at least one metal layer, and
• solder material being at least partly applied at least to the fixing section of the baseplate, which section is coated with the metal layer,
• comprising the steps
• highly precisely arranging the component above the fixing section of the baseplate, the solder material and the base surface of the component being present opposite one another without contact, a vertical distance apart so as to form an intermediate space,
• supplying heat energy in a region locally limited substantially to the fixing section for at least partial melting of the solder material from the bottom of the baseplate so that, as a result of drop formation of the molten solder material, the intermediate space is filled for mutual fixing, and
• waiting for the mutual fixing,
• the metal layer being applied to the top of the baseplate at least in the fixing section in a continuously planar manner and thus being without interruptions in the fixing section.