Method of polishing film to be polished
AssigneeTDK Corporation
InventorAkifumi Kamijima
Life of this patent
Estimating the term…
Abstract
A method comprises a main laminate making step of forming a plurality of main magnetic poles onto a substrate, covering each magnetic pole with a first protective film, and forming onto the first protective film a stopper film provided with openings at respective parts opposing the main magnetic poles, each opening being greater than a planar form of the main magnetic pole corresponding thereto, so as to make a main laminate; and a main polishing step of polishing the first protective film and main magnetic poles through the openings of the stopper film in the main laminate by a CMP method. In the main laminate making step, the stopper film is provided with a distribution of opening width.
Claims7
A method of polishing a film to be polished comprising:
- a main laminate making step of forming a plurality of films to be polished onto a substrate, covering each film to be polished with a first protective film, and forming onto the first protective film a stopper film provided with openings at respective parts opposing the films to be polished, each opening being greater than a planar form of the film to be polished corresponding thereto;
- and
- a main polishing step of polishing the first protective film and films to be processed through the openings of the stopper film in the main laminate by a CMP method;
- wherein the stopper film is provided with an opening width distribution in the main laminate making step.
Dependencies are inferred from the claim text.