Method and apparatus for local polishing control
AssigneeApplied Materials, Inc.
InventorsStan Tsai, Feng Liu, Yan Wang, Rashid Mavliev, Liang-Yuh Chen, Alain Duboust
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Abstract
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.
Claims10
A polishing pad comprising:
- one or more anodes formed in the polishing pad at or near a polishing surface of the polishing pad;
- and
- one or more cathodes formed in the polishing pad at or near the polishing surface of the polishing pad and electrically isolated from the one or more anodes.
A method of using a chemical mechanical polishing (CMP) tool to perform electrochemical mechanical polishing (ECMP) of a substrate having metal formed thereon, the method comprising:
- providing a polishing pad having one or more anodes formed in the polishing pad at or near a polishing surface of the polishing pad, and one or wore cathodes formed in the polishing pad at or near the polishing surface of the polishing pad and electrically isolated from the one or more anodes;
- introducing an electrolytic polishing fluid between the substrate and the polishing surface so as to establish an electrical circuit between the one or more anodes, the metal, and the one or more cathodes;
- providing a current to the one or more anodes and the one or more cathodes to cause electrochemical migration of metal ions from the metal into the electrolytic polishing solution;
- and
- pressing the substrate against the polishing surface while moving at least one of the polishing pad and the substrate.
Dependencies are inferred from the claim text.