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US 2006/0124446 A1Published application
Method for the production of a substrate with a magnetron sputter coating and unit for the same
AssigneeOc Oerlikon Balzers AG
InventorOthmar Zuger
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Abstract
According to the invention, the distribution of material amounts deposited on the substrate may be optimized for magnetron sputter coating in which a magnetron magnetic field pattern (9) is cyclically (My) moved along the sputtering surface (7) and a substrate (11) is passed along the sputter surface (7), whereby the sputter rate is modulated by means of a modulation device (3), phase-locked with the cyclical movement (M7) of the field pattern (9).
Claims43
1-39. (canceled)
A method of magnetron sputtering, the method comprising:
- a) providing a magnetron source with a sputter surface, the magnetron source generating a magnetron magnetic field pattern along the sputter surface;
- b) cyclically moving said magnetron magnetic field pattern along said sputter surface;
- c) positioning a substrate to be coated a distance from and facing said sputter surface;
- d) moving said substrate along said sputter surface;
- and
- e) varying an amount of material deposited on said substrate per time unit from said magnetron source that is cyclically and phase-locked with said cyclically moving said magnetron magnetic field pattern.
3 more elements
A magnetron sputtering apparatus comprising
- a) a magnetron sputter source having a sputter target with a sputter surface and a magnet arrangement, said magnet arrangement being coupled to a drive to be cyclically moved along a plane parallel to said sputter surface;
- b) a substrate conveyor arrangement for moving at least one substrate along said sputter surface;
- and
- c) a modulation arrangement cyclically modulating the amount of material per time unit sputtered off said sputter surface, said modulation arrangement being phase locked with said drive.
1 more element
Dependencies are inferred from the claim text.