Electronic parts packaging structure and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorEiji Takaike
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Abstract
An electronic parts packaging structure of the present invention, includes an insulating layer acting as a flexible substrate, an electronic parts buried in the insulating layer in a state that a whole electronic parts is covered with the insulating layer, and a wiring layer buried in the insulating layer and connected electrically to a connection pad of the electronic parts, also, a structure body in which a plurality of electronic parts are buried in the insulating layer may be folded and electronic parts may be are connected electrically.
Claims16
An electronic parts packaging structure, comprising:
- an insulating layer acting as a flexible substrate;
- an electronic parts buried in the insulating layer in a state that a whole of the electronic parts is covered with the insulating layer;
- and
- a wiring layer buried in the insulating layer and connected electrically to a connection pad of the electronic parts.
A method of manufacturing an electronic parts packaging structure, comprising the steps of:
- forming a semi-cured first insulating layer on a metal plate;
- arranging an electronic parts on the first insulating layer;
- adhering the electronic parts to the first insulating layer by curing the first insulating layer by a heat treatment;
- forming a wiring layer, which is connected electrically to the electronic parts, on the electronic parts and the first insulating layer;
- forming a second insulating layer that is made of same material as the first insulating layer and covers the electronic parts and the wiring layer;
- and
- removing selectively the metal plate from the first insulating layer.
Dependencies are inferred from the claim text.