High selective ratio and high and uniform plasma processing method and system

A system for uniformly plasma-processing a substrate on a substrate electrode at a high selectivity ratio and over a large area by applying a spatially even or uneven and temporally constant or modulated magnetic field to the plasma generating section of a vacuum container, generating a magnetic neutral line discharge plasma by means of a radio frequency antenna circuit and a plasma generating power supply connected to the radio frequency antenna circuit and supplying modulated substrate bias power to the substrate electrode in the vacuum container from a substrate bias power supply, wherein

• the plasma generating power supply and the substrate bias power supply are provided with modulation means for supplying a pulse modulation power alternately to the plasma generating section and the substrate electrode by referring to the time taken by gas to diffuse from the center of the generated plasma to the substrate,
• the plasma generating radio frequency antenna circuit comprising parallel coils for independently regulating the inter-gap distance in the azimuth direction.