Method of thermal adherend release and apparatus for thermal adherend release

An apparatus for thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly heating the heat-peelable pressure-sensitive adhesive sheet, wherein the apparatus comprises:

• a first heating section which previously heats a sticking site of an adherend to be released at a temperature at which the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet does not expand;
• and
• a second heating section which, after previously heating by the first heating section, heats the sticking site of the adherend in the heat-peelable pressure-sensitive adhesive sheet at a temperature at which the heat-expandable layer expands, to thereby selectively release the adherend.