Device and method for performing a master processing operation

A device for performing a master processing operation on a selected substrate, the device comprising:

• a base substrate;
• an adhesive carrier substrate having an inner surface facing the base substrate;
• a layer of pressure-sensitive adhesive provided on the inner surface of the adhesive carrier substrate;
• a release liner separating the base substrate from the adhesive carrier substrate, the release liner being folded along a fold line extending in a transversely extending direction to define two portions one of which is an activating portion;
• the release liner having an outer surface facing the inner surface of the adhesive carrier substrate and an inner surface of the base substrate, the outer surface being a release surface;
• the base substrate being separable from the release liner and the adhesive carrier substrate to enable the selected substrate to be positioned in a master processing position;
• the activating portion enabling the master processing operation to be performed with the selected substrate in the master processing position by pulling the activating portion of the release liner in an activating direction generally perpendicular to the transverse direction and generally parallel to the base substrate and the selected substrate so as to progressively remove the release liner from the adhesive carrier substrate and cause the pressure-sensitive adhesive to adhere to the selected substrate and any peripheral portions of the base substrate extending adjacent the periphery of the selected substrate.