Method of bonding microstructured substrates
AssigneesCommissariat a l'Energie Atomique, Biomerieux
InventorsIsabelle Chartier, Cecile Bory, Patrick Pouteau
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Abstract
Gluing process for micro-structured substrates. The invention is applicable particularly to the fabrication of micro-fluidic components. In order to glue a micro-structured substrate (2) having upper coplanar plane areas (6) and recesses between them, a grid (10) is placed above the substrate, the grid is coated with a glue (12), using a tool (16) that presses on the grid and locally brings it into contact with the areas, so as to deposit a film (20) of glue droplets on them, and the grid is removed. Furthermore, the upper coplanar plane areas (6) are treated before the film of glue droplets is deposited, this treatment being designed to adapt wettability of these areas to the glue.
Claims10
Process for gluing at least one micro-structured substrate comprising upper coplanar plane areas and recesses between them, by means of a glue that can bond to these upper coplanar plane areas, this process being characterised in that it comprises the following steps:
- a grid is placed above the substrate,
- this grid is coated with glue using a tool which presses on the grid and locally brings this grid into contact with the upper coplanar plane areas, so as to deposit a film of glue droplets on these upper coplanar plane areas, and
- the grid is removed,
- process in which the upper coplanar plane areas are treated before the film of glue droplets is deposited on it, this treatment being designed to adapt the wettability of these areas to the glue.
Dependencies are inferred from the claim text.