Apparatus and method for manufacturing copper clad laminate with improved peel strength
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Lee, Joon Shin, Hyung Park, Geum Yun
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Lee, Joon Shin, Hyung Park, Geum Yun
Estimating the term…
The present invention relates to an apparatus and method for manufacturing a copper clad laminate, which can achieve a substantial improvement in the peel strength between a thermoplastic liquid crystal polymer and a copper foil. The apparatus comprises: a coating means for thinly coating the surface of a copper foil with a thermoplastic liquid crystal polymer solution; a solvent removal means for drying the coated liquid crystal polymer solution to remove the solvent of the coated solution; and a thermal pressing means for laminating and thermally pressing a thermoplastic liquid crystal polymer film onto the copper foil using heating rolls so as to make a copper clad laminate.
An apparatus for manufacturing a copper clad laminate, comprising:
A method for manufacturing a copper clad laminate, comprising the steps of:
Dependencies are inferred from the claim text.