Process for forming a composite Ni and Cu alloy plating film
AssigneeHonda Giken Kogyo Kabushiki Kaisha
InventorsOsamu Ishigami, Tomohiro Hirata, Yoshimitsu Ogawa, Nobuhiko Yoshimoto
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Abstract
A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high corrosion resistance and a copper alloy improves the corrosion resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.
Claims15
1-11. (canceled)
A process for forming a composite nickel and copper alloy plating film on a base surface, comprising the steps of:
- preparing a composite nickel and copper alloy plating solution containing nickel, copper, self-lubricating particles, hard particles, a cationic surface active agent and sodium saccharate as a hardness raising agent;
- and
- supplying an electric current to the solution and the base.
Dependencies are inferred from the claim text.