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US 2006/0123626 A1Published application
Method of making circuitized substrate assembly
AssigneeEndicott Interconnect Technologies, Inc.
InventorsJames Fuller, John Lauffer, Voya Markovich
Life of this patent
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Abstract
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is placed over one of the openings and a quantity of conductive paste is positioned thereon prior to bonding the substrates. At least some of the paste is then forced up into an opening in the other substrate as a result of the bonding.
Claims6
A method of making a circuitized substrate assembly, said method comprising:
- providing a first circuitized substrate having an opening therein;
- providing a second circuitized substrate having an opening therein;
- positioning an electrically conductive cover member on a surface of said second circuitized substrate facing said first circuitized substrate to substantially cover said opening in said second circuitized substrate;
- positioning a quantity of electrically conductive paste on said cover member;
- aligning said first and second circuitized substrates such that said openings in said circuitized substrates are substantially aligned;
- and
- bonding said first and second circuitized substrates such that said quantity of electrically conductive paste only partly fills said opening in said first circuitized substrate.
4 more elements
Dependencies are inferred from the claim text.