Placement system for populating a substrate with electronic components
AssigneeInfineon Technologies AG
InventorsJurgen Hogerl, Jens Pohl, Uta Sasse, Ingo Wennemuth
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Abstract
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
Claims18
A placement system for populating a substrate with at least one electronic component of a semiconductor wafer divided into electronic components, the placement system comprising:
- a substrate holding device for receiving the substrate;
- a wafer holding device disposed above said substrate holding device and adapted to receive a wafer holding frame;
- said substrate holding device and said wafer holding device being disposed to be positioned with respect to one another horizontally in an X direction and a Y direction;
- a vacuum forceps holding device disposed above said wafer holding device, said vacuum forceps holding device having a vacuum forceps, which can be finely adjusted in the X direction and the Y direction with regard to said substrate holding device and disposed to be rotatable and finely adjustable about a Z axis extending in a Z direction;
- and
- said vacuum forceps holding device being configured to move said vacuum forceps, in a region of said wafer holding frame, vertically in the Z direction into a rest position, into a preliminary position, and into a mounting position.
Dependencies are inferred from the claim text.