Handler for semiconductor singulation and method therefor

A handler for singulating at least one packaged substrate into a plurality of packaged semiconductor devices by using a water jet, the handler comprising:

• a first movable mount for moving between a loading location and a cutting location, the first movable mount adapted to receive the at least one packaged substrate at the loading location, the first movable mount for transporting the at least one packaged substrate from the loading location to the cutting location, and the first movable mount adapted to secure the at least one packaged substrate thereon while the at least one packaged substrate is at let partially cut at the cutting location;
• and
• a second movable mount for moving between the cutting location and an unloading location, the second movable mount adapted to receive the at least one packaged substrate that is at least partially cut at the cutting location, the second movable mount for securing the at least one packaged substrate thereon while the at least one packaged substrate is at least partially cut at the cutting location to produce at least some of the plurality of packaged semiconductor devices, and the second movable mount for transporting the at least some of the plurality of packaged semiconductor devices from the cutting location to the unloading location.