Automatic addition of power connections to chip power
AssigneeInternational Business Machines Corporation
InventorsJoachim Keinert, Juergen Pille, Christian Schweizer, Jens Noack
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AssigneeInternational Business Machines Corporation
InventorsJoachim Keinert, Juergen Pille, Christian Schweizer, Jens Noack
Estimating the term…
The present invention relates to a method for designing a hierarchical, multi-layer integrated circuit (IC) chip design in which a first stage design at a lower level of the hierarchical design provides details of circuit features that occupy areas of the design, and in a higher level stage of the design process corresponding to a higher level of the hierarchy, those details are used to determine free areas in the lower level design that are not yet occupied by circuit features, and allowing further processing of those free areas during the higher level design stage. For example, this may include identifying free tracks within a basic power grid layer and implementing additional power wiring within that power grid layer without having to redo the lower level design.
A method for designing a hierarchical, multi-layer integrated circuit (IC) chip design having a plurality of hierarchical levels of said multi-layer IC design ordered from a lower to a higher level, wherein a lower hierarchical level comprises a subset of the next higher-level, the method comprising:
A computer program product comprising a computer usable medium having a computer readable program for designing a hierarchical, multi-layer integrated circuit (IC) chip design having a plurality of hierarchical levels of said multi-layer IC design ordered from a lower to a higher level, wherein a lower hierarchical level comprises a subset of the next higher-level, said computer readable program embodied in said medium, wherein the computer readable program when executed on a computer causes the computer to perform the steps of:
The computer program product of claim 15, wherein said hierarchical levels comprise a macro level, a unit level and a chip level.
The method according to claim 18, wherein said performing further design processing comprises implementing additional power wiring in said free tracks of said first multi-layer design.
Dependencies are inferred from the claim text.