Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products
AssigneeJsr Corporation
InventorsTakashi Nishioka, Hirofumi Goto, Katsumi Inomata, Shin-ichirou Iwanaga
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Abstract
A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.
Claims12
A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which, when cured with heat, can produce a cured product with elastic modulus of less than 1 GPa.
Dependencies are inferred from the claim text.