Low dielectric constant substrate
AssigneeIndustrial Technology Research Institute
InventorsChun-Kuo Min, Hsi-Hsin Shih, Mao-Feng Hsu, Hsin-Hung Yao
Life of this patent
Estimating the term…
Abstract
A mesoporous silica powder. The powder comprises an open pore structure, generates a diffractive peak when irradiated by an X-ray with an incident angle of less than about 10 degrees.
Claims36
A mesoporous silica powder, the mesoporous silica powder comprises an open pore structure, and generates a diffractive peak when irradiated by an X-ray with an incident angle of less than about 10 degrees.
A low dielectric constant epoxy resin precursor solution, comprising, based on the total weight of the precursor solution:
- about 60˜80 wt % of an epoxy resin;
- about 1-20 wt % of a mesoporous silica powder;
- about 0.001˜1 wt % of a catalyst;
- about 1˜5 wt % of a curing agent;
- and
- about 10˜30 wt % of a solvent.
A low dielectric constant polyimide resin precursor solution, comprising, based on the total weight of the precursor solution:
- about 60˜80 wt % of a polyimide resin precursor;
- about 10-30 wt % of a solvent;
- about 0.001˜1 wt % of a catalyst;
- and
- about 1-20 wt % of a mesoporous silica powder.
A low dielectric constant substrate, comprising:
- a resin;
- and
- a mesoporous silica powder dispersed in the resin having an open nanopore structure.
A method for forming a low dielectric constant substrate, comprising:
- providing a mesoporous silica powder precursor solution;
- forming a mesoporous silica powder as a low dielectric constant substrate filler from the mesoporous silica powder precursor solution;
- adding a varnish comprising a resin to the low dielectric constant substrate filler;
- adding a support to the varnish;
- and
- removing the support from the varnish and curing the support to form a low dielectric constant substrate.
Dependencies are inferred from the claim text.