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US 2006/0079162 A1Published application
CMP conditioner
AssigneeMitsubishi Materials Corporation
InventorsTetsuji Yamashita, Takashi Kimura, Hanako Hata
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Abstract
A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
Claims8
A CMP conditioner in which diamond grit is adhered to a conditioning surface that faces and is in contact with a polishing pad of a CMP apparatus, wherein
- the diamond grit is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
Dependencies are inferred from the claim text.