Wafer grinding method
AssigneeDisco Corporation
InventorsMasaru Nakamura, Yosuke Watanabe, Satoshi Kobayashi, Noboru Takeda, Masanori Yoshida, Takashi Sanpei, Masahiro Murata
Life of this patent
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Abstract
A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance; and a grinding step for grinding the surface to be ground of the wafer whose outer peripheral portion has been removed, to a predetermined finish thickness.
Claims5
A wafer grinding method for grinding a surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising:
- an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance;
- and
- a grinding step for grinding the surface to be ground of the wafer whose outer peripheral portion has been removed, to a predetermined finish thickness.
A wafer grinding method for grinding the back surface of a wafer having a plurality of function elements on the front surface thereof and an arcuatedly chamfered outer peripheral surface, comprising:
- a groove forming step for forming an annular groove deeper than at least the finish thickness of the wafer from the front surface of the wafer by applying a laser beam of a wavelength having absorptivity for the wafer from the front surface of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance;
- and
- a grinding step for grinding the back surface of the wafer having the groove formed thereon, to a predetermined finish thickness.
Dependencies are inferred from the claim text.