High density plasma grown silicon nitride
AssigneeSharp Laboratories of America, Inc.
InventorsPooran Joshi, Apostolos Voutsas, John Hartzell
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AssigneeSharp Laboratories of America, Inc.
InventorsPooran Joshi, Apostolos Voutsas, John Hartzell
Estimating the term…
A method is provided for forming a silicon nitride (SiNx) film. The method comprises: providing a Si substrate or Si film layer; optionally maintaining a substrate temperature of about 400 degrees C., or less; performing a high-density (HD) nitrogen plasma process where a top electrode is connected to an inductively coupled HD plasma source; and, forming a grown layer of SiNx overlying the substrate. More specifically, the HD nitrogen plasma process includes using an inductively coupled plasma (ICP) source to supply power to a top electrode, independent of the power and frequency of the power that is supplied to the bottom electrode, in an atmosphere with a nitrogen source gas. The SiNx layer can be grown at an initial growth rate of at least about 20 Å in about the first minute.
A method for forming a silicon nitride (SiNx) film, the method comprising:
A method for enhancing the nitrogen (N) content in a silicon nitride (SiNx) film, the method comprising:
A method for the nitridation of a substrate, the method comprising:
A method for passivating the structure of a substrate, the method comprising:
Dependencies are inferred from the claim text.