Polishing method
OwnerTetsuji Togawa, Makoto Fukushima +4inventors
InventorsTetsuji Togawa, Makoto Fukushima, Kunihiko Sakurai, Hiroshi Yoshida, Osamu Nabeya, Teruhiko Ichimura
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OwnerTetsuji Togawa, Makoto Fukushima +4inventors
InventorsTetsuji Togawa, Makoto Fukushima, Kunihiko Sakurai, Hiroshi Yoshida, Osamu Nabeya, Teruhiko Ichimura
Estimating the term…
The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).
1-5. (canceled)
A polishing apparatus for polishing a workpiece, said polishing apparatus comprising:
A polishing apparatus for polishing a workpiece, said polishing apparatus comprising:
A polishing apparatus for polishing a workpiece, said polishing apparatus comprising:
Dependencies are inferred from the claim text.