Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment

A process for applying a metal structure to a workpiece comprising:

• providing a workpiece having a metallized layer;
• contacting a surface of the metallized layer with an inorganic acid solution in the absence of electroplating power to form an inorganic acid-treated surface without depositing metal onto the inorganic acid treated surface;
• contacting the acid-treated metallized layer with an electroplating bath in the presence of electroplating power to electroplate a metal species onto the acid-treated surface to form a composite layer composed of the acid-treated metallized layer and the electroplated metal species;
• and
• electrochemically depositing additional metal onto the composite layer.

A method for forming a copper feature on a surface of a microelectronic workpiece comprising:

• providing a workpiece having a metallized layer;
• contacting a surface of the metallized layer with an inorganic acid solution in the absence of electroplating power to form an inorganic acid-treated surface without depositing metal onto the inorganic acid treated surface, the inorganic acid content of the inorganic acid solution being less than about 5 wt %;
• and
• electrochemically forming a copper feature on the inorganic acid-treated surface of the metallized layer.