Manufacturing method of a semiconductor device

A manufacturing method of a semiconductor device, comprising the steps of:

• (a) preparing a lead frame including a plurality of leads which have a first main surface being a mounting surface, and a second main surface being arranged in an opposite side of the first main surface, and having a first part, and a second part whose thickness is thinner than the first part, and in which each length of an extending direction of the second main surface was furthermore formed shorter than the first main surface, and a length of an extending direction of the first part was formed shorter than the second part, and a chip mounting part arranged inside the plurality of leads;
• (b) mounting a semiconductor chip over the chip mounting part so that a back surface of the semiconductor chip and the second part of the lead may oppose;
• (c) connecting an electrode of the semiconductor chip, and the second main surface of the first part of the lead with a conductive wire;
• (d) forming a molded body performing resin molding of the semiconductor chip and the conductive wire in the condition covering a plurality of device formation areas by which block formation was performed over the lead frame by one mold cavity of a resin-molding metal mold so that the each first main surface of the plurality of leads may be exposed to a back surface of the molded body;
• and
• (e) individually separating each of the plurality of leads from the lead frame by dicing;
• wherein in the step (c), the electrode of the semiconductor chip and the conductive wire are connected previously, and the second main surface of the first part of the lead and the conductive wire are connected after that.