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US 2006/0079020 A1Published application
Semiconductor device and a method of assembling a semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsShoko Omizo, Mikio Matsui
Life of this patent
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Abstract
A semiconductor device includes a base substrate; a first fixing layer provided on the base substrate; a first semiconductor chip fixed on the first fixing layer; a first substrate provided above the first semiconductor chip; a plurality of first connection members isolated from the first semiconductor chip, electrically connecting to the first substrate with the base substrate; and a first encapsulating layer provided around the first connection members.
Claims20
A semiconductor device comprising:
- a base substrate;
- a first fixing layer provided on the base substrate;
- a first semiconductor chip fixed on the first fixing layer;
- a first substrate provided above the first semiconductor chip;
- a plurality of first connection members isolated from the first semiconductor chip, electrically connecting to the first substrate with the base substrate;
- and
- a first encapsulating layer provided around the first connection members.
4 more elements
A method of assembling a semiconductor device comprising:
- providing a first fixing layer on a base substrate;
- facing a first substrate to the base substrate, the first substrate attaching a first semiconductor chip under a bottom surface of the first substrate;
- fixing the first semiconductor chip to the first fixing layer;
- providing a plurality of first connection members between the first substrate and the base substrate so as to connect the first substrate and the base substrate;
- and
- providing a first substrate encapsulating layer around the first connection members.
3 more elements
Dependencies are inferred from the claim text.