Method for producing an optical or electronic module provided with a plastic package
AssigneeInfineon Technologies Fiber Optics GmbH
InventorsHans Hurt, Martin Weigert
Life of this patent
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Abstract
A method for producing an optical or electronic module provided with a plastic package in which at least one optical or electronic component having an operative region is encapsulated with at least one polymer compound to form the plastic package. Portions of the polymer compound are then removed by a device, such as a laser, in such a way that an opening is defined in the polymer compound between the operative region of the component and the outer side of the plastic package. A functional structure is then introduced into the remaining polymer compound by the device.
Claims19
A method for producing an optical or electronic module provided with a plastic package, the method comprising:
- providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module,
- encapsulating the at least one component with at least one polymer compound to form the plastic package,
- partially removing the polymer compound from the outside by a device for the partial removal of the polymer compound in such a way that the polymer compound between the operative region of the component and the outer side of the plastic package is at least partially removed, and
- introducting a functional structure into the remaining polymer compound by means of the device.
A method for producing a module including at a component housed in a plastic package, said component comprising at least one of an optical component and an electronic component, the method comprising:
- encapsulating said at least one component in a polymer compound such that the polymer compound forms at least a portion of the plastic package;
- utilizing a single tool to remove portions of the polymer compound such that the plastic package defines both an opening that exposes the component and one or more functional holes;
- and
- mounting a functional structure into at least one of the opening and said one or more functional holes.
Dependencies are inferred from the claim text.