Manufacturing method of pickup device
AssigneeSharp Kabushiki Kaisha
InventorShigehiro Yamada
Life of this patent
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Abstract
In a manufacturing method of a pickup device, a hologram element is positioned on a package by turning the hologram element around the Z axis and then by moving the element in the Y-axis direction so as to maximize the light reception intensity of reflected light from the hologram element at a photodetector. This makes it possible to reduce the displacement of the turning angle around the Z axis of the hologram element with respect to the package. Thus, the pickup device is prevented from protruding from the housing when the device is attached to the housing the arrangement of the optical components satisfactorily improved in accuracy, which allows the pickup device to be reduced in size.
Claims3
A manufacturing method of a pickup device, comprising the steps of:
- attaching a light-emitting element and a photodetector to a package;
- placing a hologram element on the package;
- reflecting light applied from the light-emitting element to a disk via the hologram element and making the reflected light incident on the photodetector via the hologram element;
- turning the hologram element around an optical axis of the light-emitting element and moving the hologram element in one direction on a plane perpendicular to the optical axis of the light-emitting element so that a light reception intensity of the reflected light at the photodetector is maximized;
- and
- positioning the hologram element on the package.
Dependencies are inferred from the claim text.