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US 2006/0079010 A1Published application
Transfer base substrate and method of semiconductor device
AssigneeSeiko Epson Corporation
InventorsHiroyuki Hara, Tatsuya Shimoda
Life of this patent
Estimating the term…
Abstract
A transfer base substrate comprises: a substrate; a plurality of transfer thin film circuits formed on the substrate via removing layer; a test circuit formed on the substrate for checking circuit operation; and a wiring coupling each of transfer thin film circuits with a test circuit.
Claims17
A transfer base substrate comprising:
- a substrate;
- a plurality of transfer thin film circuits formed on the substrate via removing layer,
- a test circuit that is formed on the substrate and that checks circuit operations of the plurality of transfer thin film circuits;
- and
- a wiring coupling each of the plurality of transfer thin film circuits with the test circuit.
2 more elements
A method of manufacturing a semiconductor device, comprising:
- forming a plurality of transfer thin film circuits which are capable of being removed and transferred on a transfer base substrate;
- forming a test circuit that checks circuit operation of each of the plurality of transfer thin film circuits on the transfer base substrate;
- obtaining test data of each of the plurality of transfer thin film circuits after the forming the plurality of transfer thin film circuits on the transfer base substrate by checking the circuit operation of each of the plurality of transfer thin film circuits via the test circuit;
- and
- at least one of the transfer thin film circuits transferring into a substrate after the obtaining.
2 more elements
A method of checking of a plurality of transfer thin film circuits which are formed on a transfer base substrate, the method comprising:
- checking a operation of each of the plurality of transfer thin film circuits by a test circuits that is formed on the transfer base substrate and that is coupled with the plurality of transfer thin film circuits.
A method of manufacturing a transfer base substrate, comprising:
- forming a plurality of transfer thin film circuits which are capable of being removed and transferred on a substrate,
- forming a test circuit for checking the operation of each of the plurality of transfer thin film circuits on a transfer base substrate;
- forming a wiring separating one of the plurality of transfer thin film circuits from others so as to connect each of the plurality of transfer thin film circuits with a test circuit.
Dependencies are inferred from the claim text.