Fine-pitch electronic socket for temporary or permanent attachments
OwnerPeter Salmon, Howard Johnsoninventors
Life of this patent
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Abstract
An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.
Claims9
A socket for connecting bumped terminals of an electronic component to corresponding traces of an interconnection circuit comprising:
- an assembly layer having an array of wells corresponding to said bumped terminals on the surface of said interconnection circuit;
- conductive walls on said wells;
- a conductive fluid or paste filling said wells;
- and,
- conductive elements connecting said conductive walls to selected ones of said traces of said interconnection circuit.
A socket for temporary attachment of an electronic component to a substrate having interconnection circuits comprising:
- an array of conductive mesas or bumps at terminals of said electronic component;
- an assembly layer having a corresponding array of wells having conductive walls on said substrate;
- a conductive fluid or paste filling said wells;
- and,
- connections between said conductive walls and selected traces of said interconnection circuits;
- wherein said mesas or bumps are inserted in the conductive fluid or paste in said wells to create said temporary attachment.
A dual-purpose socket for both temporary and permanent connection of an electronic component to a substrate having interconnection circuits comprising:
- an array of conductive mesas at terminals of said electronic component;
- a corresponding array of wells having conductive walls on said substrate;
- connections between said conductive walls and selected traces of said interconnection circuits;
- a conductive fluid or paste filled in said wells to effect temporary attachment, and the same or a different conductive material that can be converted to a binding solid to effect permanent attachment;
- and
- wherein said mesas are inserted into the conductive fluid or paste in said wells to effect said temporary attachment.
A method for testing an electronic component comprising the steps of:
- a) providing an array of conductive mesas at terminals of said component;
- b) providing an assembly layer having a corresponding array of wells having conductive walls on a test substrate;
- c) providing connections between said conductive walls and selected traces in said test substrate;
- d) connecting said selected traces to terminals of a tester;
- e) filling said wells with a conductive fluid or paste;
- and
- f) inserting said mesas into said wells for the duration of said test.
Dependencies are inferred from the claim text.