Inspection method of bonded status of ball in wire bonding
AssigneeKaijo Corporation
InventorsKimiji Nishimaki, Noritaka Horiuchi
Life of this patent
Estimating the term…
Abstract
An inspection method of a bonded status of a ball bonded to a pad of a semiconductor chip in wire bonding which attains wiring between the pad of the semiconductor chip and an external electrode is disclosed, wherein an image of a bonding portion between the pad and the ball is taken by an image taking means to detect the bonded status of the ball through image processing of a plane image taken by the image taking means. In the method, coaxial light parallel to an optical axis of a lens of the image taking means is utilized as illumination light illuminating the bonding portion between the pad and the ball, and the color of the coaxial light is switched depending on the details of the inspection.
Claims12
An inspection method of a bonded status of a ball bonded to a pad of a semiconductor chip in wire bonding which attains wiring between the pad of the semiconductor chip and an external electrode, wherein an image of a bonding portion between the pad and the ball is taken by an image taking means and a plane image taken by the image taking means is image processed to detect the bonded status of the ball, the method comprising:
- utilizing coaxial light parallel to an optical axis of a lens of the image taking means as illumination light illuminating the bonding portion between the pad and the ball;
- and
- switching the color of the coaxial light depending on details of the inspection.
Dependencies are inferred from the claim text.