Process for controlling wettability of electrochemical plating component surfaces
OwnerBrian Lueinventor
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Abstract
A method for modifying the surface of an electrochemical plating component by treatment with ultraviolet light and/or ozone to improve the wettability of the surface. A method for controlling the wettability of the surface of an electrochemical plating component by rapidly cooling a melted polymer employed to form the surface. The electrochemical plating components produced from these methods of modifying and/or controlling surface wettability.
Claims26
A method for modifying the wettability of a contact ring polymer surface, comprising:
- irradiating the polymer surface of the contact ring with ultraviolet radiation.
A method for modifying the wettability of a contact ring polymer surface, comprising:
- exposing the polymer surface of the contact ring to ozone.
A method for controlling the wettability of a contact ring polymer surface, comprising:
- rapidly solidifying a liquefied polymer surface of the contact ring.
Dependencies are inferred from the claim text.