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US 2006/0078256 A1Published application
Light modulator package having inclined light transmissive lid
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYeong Lee, Dong Shin, Heung Park, Jun An, Yurlov Victor
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Abstract
Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.
Claims4
A light modulator package, comprising:
- a substrate;
- a light modulating device comprising a plurality of light modulating elements provided on the substrate, and reflecting or diffracting incident light;
- a joint layer provided on the substrate to surround the light modulating device;
- and
- a light transmissive lid attached to the joint layer such that an outer surface of the light transmissive lid is inclined relative to a reflective surface of the light modulating elements of the light modulating device, and covering the light modulating elements.
2 more elements
Dependencies are inferred from the claim text.